Nickel interlayer on the microstructure and property of TC6 to copper alloy diffusion bonding
Author:
Affiliation:
1. School of Materials Science and Engineering, Hefei University of Technology, Hefei, China
2. School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
https://www.tandfonline.com/doi/pdf/10.1080/01694243.2018.1429860
Reference20 articles.
1. Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer
2. High temperature deformation behavior of the TC6 titanium alloy under the uniform DC electric field
3. Direct diffusion bonding of immiscible tungsten and copper at temperature close to Copper's melting point
4. Narrow gap multi-pass laser butt welding of explosion welded CP-Ti/Q235B bimetallic sheet by using a copper interlayer
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