Partial replacement of urea-formaldehyde adhesive with fungal biomass and soy flour in plywood fabrication
Author:
Affiliation:
1. Department of Wood and Paper Sciences and Technology, Tarbiat Modares University, Tehran, Iran;
2. Swedish Centre for Resource Recovery, University of Borås, Borås, Sweden
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
https://www.tandfonline.com/doi/pdf/10.1080/01694243.2019.1707948
Reference35 articles.
1. Alternative to latent catalysts for curing UF resins used in the production of low formaldehyde emission wood-based panels
2. A new formaldehyde-free wood adhesive from renewable materials
3. Research Progress on Formaldehyde Emission of Wood-Based Panel
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