Polyamide-formaldehyde resin as a low-toxic adhesive for wood bonding
Author:
Affiliation:
1. School of Chemical and Material Engineering, Jiangnan University, Wuxi, China
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
https://www.tandfonline.com/doi/pdf/10.1080/01694243.2021.1994757
Reference38 articles.
1. Urea–formaldehyde (UF) adhesive resins for wood
2. Adhesives Based on Formaldehyde Condensation Resins
3. A High‐Performance Bio‐Adhesive Using Hyperbranched Aminated Soybean Polysaccharide and Bio‐Based Epoxide
4. Cottonseed protein-based wood adhesive reinforced with nanocellulose
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