Relationship between thermal curing behavior and bond strength development in formaldehyde-based resins with different molecular weights-Reference-Cited by-同舟云学术

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Relationship between thermal curing behavior and bond strength development in formaldehyde-based resins with different molecular weights

Published:2024-02-07 Issue:15 Volume:38 Page:2711-2730
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Wibowo Eko Setio¹²^ORCID,Park Byung-Dae¹^ORCID,Žigon Jure³^ORCID,Šernek Milan³^ORCID

Affiliation:

1. Department of Wood and Paper Science, Kyungpook National University, Daegu, Republic of Korea

2. Research Center for Biomass and Bioproducts, National Research and Innovation Agency, Bogor, Indonesia

3. Department of Wood Science and Technology, Biotechnical Faculty, University of Ljubljana, Ljubljana, Slovenia

Funder

Korea Forestry Promotion Institute

Slovenian Research Agency

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/01694243.2024.2314369

Reference43 articles.

1. Urea–formaldehyde resin prepared with concentrated formaldehyde

2. Eco-Friendly, High-Density Fiberboards Bonded with Urea-Formaldehyde and Ammonium Lignosulfonate

3. Recent progress in ultra-low formaldehyde emitting adhesive systems and formaldehyde scavengers in wood-based panels: a review;Kristak L;Wood Mater Sci Eng,2022

4. Formaldehyde-Free Resins for the Wood-Based Panel Industry: Alternatives to Formaldehyde and Novel Hardeners

5. Relationship between curing activation energy and free formaldehyde content in urea-formaldehyde resins

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