CONTROL OF TRANSIENT RESPONSE IN INTELLIGENT PIEZOTHERMOELASTIC STRUCTURES
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1080/713855952
Reference51 articles.
1. 3D Solutions for Free Vibration of Initially Stressed Thermoelectroelastic Multilayered Cylinders
2. Control of the transient thermoelastic displacement of a functionally graded rectangular plate bonded to a piezoelectric plate due to nonuniform heating
3. Mindlin, R. D. 1961.On the Equations of Motion of Piezoelectric Crystals, Problems of Continuum Mechanics (N.I. Muskhelishvili 70th Birthday Volume), 282–290. Philadelphia: Soc. Ind. Appl. Math.
4. Equations of high frequency vibrations of thermopiezoelectric crystal plates
5. On the nonlinear equations of thermo-electroelasticity
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