Thin-film evaporation on microgrooved heatsinks-Reference-Cited by-同舟云学术

Thin-film evaporation on microgrooved heatsinks

Published:2017-01-05 Issue:2 Volume:71 Page:111-127
ISSN:1040-7782
Container-title:Numerical Heat Transfer, Part A: Applications
language:en
Short-container-title:Numerical Heat Transfer, Part A: Applications

Author:

Mandel Raphael¹,Shooshtari Amir¹,Ohadi Michael¹

Affiliation:

1. Small and Smart Thermal Systems Laboratory, Department of Mechanical Engineering, University of Maryland, College Park, MD, USA

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,Numerical Analysis

Link

https://www.tandfonline.com/doi/pdf/10.1080/10407782.2016.1257300

Reference34 articles.

1. DARPA, “Intrachip/Interchip Enhanced Cooling Fundamentals (ICECool Fundamentals),” in DARPA-BAA-12-50, 2012. https://www.fbo.gov/index?s=opportunity&mode=form&id=d8db5ea850b52ec3a5ebc2649e11f798&tab=core&_cview=1 (accessed 1 May 2016)

2. S. Hasebe, N. Shikazono, and N. Kasagi, Modeling and Design of Micro Groove Falling Film Evaporators,ASME 2004 2nd Int. Conf. Microchannels Minichannels,Rochester NY, USA, pp. 453–459, ASME, 2004.

3. Analysis of the heat transfer coefficient of grooved heat pipe evaporator walls

4. Temperature Variation and Heat Transfer in Triangular Grooves with an Evaporating Film

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