1. Trinamic application note 005, Rev. 1.01, http://www.trinamic.com, 2013.
2. Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air), Jedec Solid State Technology Association, JESD51–2A, 2008.
3. Guidelines for Reporting and Using Electronic Package Thermal Information, Jedec Solid State Technology Association, JESD51–12, 2005.
4. Semiconductor and IC Package Thermal Metrics, Application Report, Texas Instruments, SPRA953B–July 2012.
5. Analysis of Entropy Generation for Mixed Convection in a Square Cavity for Various Thermal Boundary Conditions