Experimental and Numerical Study of Transient Electronic Chip Cooling by Liquid Flow in Microchannel Heat Sinks-Reference-Cited by-同舟云学术

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Experimental and Numerical Study of Transient Electronic Chip Cooling by Liquid Flow in Microchannel Heat Sinks

Published:2014-01-10 Issue:7 Volume:65 Page:627-643
ISSN:1040-7782
Container-title:Numerical Heat Transfer, Part A: Applications
language:en
Short-container-title:Numerical Heat Transfer, Part A: Applications

Author:

Zhang Jingru,Zhang Tiantian,Prakash Shaurya,Jaluria Yogesh

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,Numerical Analysis

Link

http://www.tandfonline.com/doi/pdf/10.1080/10407782.2013.846594

Reference17 articles.

1. ITRS,International Technology Roadmap for Semiconductors, 2008, http://www.itrs.net/Links/2008ITRS/home2008.htm.

2. High-performance heat sinking for VLSI

3. R. J. Philips , Forced-Convection, Liquid-Cooled Microchannel Heat Sinks, Ph.D. Dissertation, MIT, 1988

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