A Discussion on the Development of SCF-CO2Hot Embossing Molding Technology and Replication Moldability-Reference-Cited by-同舟云学术

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A Discussion on the Development of SCF-CO2Hot Embossing Molding Technology and Replication Moldability

Published:2013-05-03 Issue:6 Volume:52 Page:539-545
ISSN:0360-2559
Container-title:Polymer-Plastics Technology and Engineering
language:en
Short-container-title:Polymer-Plastics Technology and Engineering

Author:

Weng Yung-Jin,Huang Jen-Ching

Publisher

Informa UK Limited

Subject

Materials Chemistry,Polymers and Plastics,General Chemical Engineering,Materials Science (miscellaneous)

Link

http://www.tandfonline.com/doi/pdf/10.1080/03602559.2012.762376

Reference16 articles.

1. High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS

2. Improving yield, accuracy and complexity in surface tension self-assembled MOEMS

3. Direct Imprinting Using Magnetic Nickel Mold and Electromagnetism Assisted Pressure for Replication of Microstructures

4. Flow Visualization of Filling Process during Micro-Injection Molding

5. Optimizations of the Processing Parameters of High-Performance Engineering Plastic in Injection Molding

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Current innovations in roller embossing—a comprehensive review;Microsystem Technologies;2022-03-10

2. Recent developments in hot embossing – a review;Materials and Manufacturing Processes;2020-10-16

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