Glass Fiber/Polyphthalamide Composites for 3D-Molded Interconnect Devices Application: Structure and Properties-Reference-Cited by-同舟云学术

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Glass Fiber/Polyphthalamide Composites for 3D-Molded Interconnect Devices Application: Structure and Properties

Published:2016-04-19 Issue:15 Volume:55 Page:1613-1622
ISSN:0360-2559
Container-title:Polymer-Plastics Technology and Engineering
language:en
Short-container-title:Polymer-Plastics Technology and Engineering

Author:

Siengchin Suchart,Chuaping Supakit,Mann Thomas

Funder

This work was financially supported by the National Research Council of Thailand (NRCT) under the grant agreement KMUTNB-GOV-59-44.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Polymers and Plastics,General Chemical Engineering,Materials Science (miscellaneous)

Link

http://www.tandfonline.com/doi/pdf/10.1080/03602559.2016.1163599

Reference19 articles.

1. Pfeffer, M.; Goth, C.; Craiovan, D.; Franke, J. 3D-assembly of molded interconnect devices with standard SMD pick & place machines using an active multi axis workpiece carrier, IEEE International Symposium on Assembly and Manufacturing, Tampere, May 25–27, 2011.

2. Feldmann, K.; Poehlau, F. MID in the automotive industry-potentials benefits and applications, 22nd International Symposium on Electronics Manufacturing Technology, Berlin, Apr 28–29, 1998.

3. A multilayer process for the connection of fine‐pitch‐devices on molded interconnect devices (MIDs)

4. Brose, A.; Leneke, T.; Hirsch, S.; Schmidt, B. Aerosol deposition of catalytic ink to fabricate fine pitch metallizations for moulded interconnect devices (MID), 3rd Conference on Electronic System-Integration Technology, Berlin, Sep 13–14, 2010.

5. Goth, C.; Putzo, S.; Franke, J. Aerosol Jet printing on rapid prototyping materials for fine pitch electronic applications, 61st IEEE Conference on Electronic Components and Technology, Lake Buena Vista, FL, May 31–Jun 3, 2011.

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