Thermal/mechanical analysis of novel Ceramic‐TSOP using nonlinear finite element method
Author:
Publisher
Informa UK Limited
Subject
General Engineering
Link
http://www.tandfonline.com/doi/pdf/10.1080/02533839.2001.9670642
Reference15 articles.
1. Stress Analysis and Thermal Characterization of a High Pin Count PQFP
2. A novel robust and low cost chips package and its thermal performance
3. Fatigue of 60/40 Solder
4. Solder Joint Reliability
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