Effects of thermal and moisture absorption on contact forces of electronic connectors
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Published:2009-09
Issue:6
Volume:32
Page:771-777
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ISSN:0253-3839
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Container-title:Journal of the Chinese Institute of Engineers
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language:en
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Short-container-title:Journal of the Chinese Institute of Engineers
Author:
Liao Kuo‐Chi,Lin Kai‐Hu
Publisher
Informa UK Limited
Subject
General Engineering