Author:
Huang Wen‐Tzeng,Chou Ching‐Tung,Lin In‐Shiuh,Chen Chin‐Hsing
Reference10 articles.
1. Cuny, R. “SPICE and IBIS Modeling Kits— the Basis for Signal Integrity Analyses,”. IEEE 1996 International Symposium on Electromagnetic Compatibility. pp.204–208.
2. Understanding the importance of signal integrity
3. Version 4.0,2002
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献