Mode III fracture problem of an FGPM strip bonded to an FGPM half-plane with embedded arbitrarily oriented cracks
Author:
Publisher
Informa UK Limited
Subject
General Engineering
Link
http://www.tandfonline.com/doi/pdf/10.1080/02533839.2012.638520
Reference28 articles.
1. Stress solution for a crack at an arbitrary angle to an interface
2. Stress intensity factors for an inclined edge crack in a semiplane
3. The central crack problem for a functionally graded piezoelectric strip
4. Antiplane mechanical and inplane electric time-dependent load applied to two coplanar cracks in piezoelectric ceramic material
5. The problem for bonded half-planes containing a crack at an arbitrary angle to the graded interfacial zone
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1. Anti-plane crack problem of a functionally graded piezoelectric materials strip with arbitrarily distributed properties;Acta Mechanica;2019-12-14
2. The Higher Order Mechanical and Electric Fields for Arbitrarily Oriented Crack with the Physical Weak-Discontinuity;Applied Mechanics and Materials;2014-08
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