1. Celik, M., Ocali, O., Tan, M. A. and Atalar, A. “Improving AWE Accuracy Using Multipoint Pade Approximation,”. IEEE IEEE International Symposium on Circuits and Systems. Vol. 1, pp.379–382. ISCAS'94
2. Chen, J. E. and Yip, G. “SPICE Models for Thermal and Vibration Analysis of Printed Circuit Boards,”. Proc. of the 27th Intersociety Energy Conversion Engineering Conf. pp.287–292.
3. Funk, J. N., Menguc, M. P., Tagavi, K. A. and Cremers, C. J. “A Semi‐Analytical Method to Predict Printed Circuit Board Package Temperatures,”. IEEE SEMI_THERM VII Proceedings. pp.7–14.