Epoxy Composites Filled with Micro-Sized AlN Particles for Microelectronic Applications
Author:
Publisher
Informa UK Limited
Subject
General Chemical Engineering
Link
http://www.tandfonline.com/doi/pdf/10.1080/02726351.2014.919547
Reference23 articles.
1. Thermal and dielectric behavior of epoxy composites filled with ceramic micro particulates
2. Thermal conductivity of epoxy adhesives filled with silver particles
3. Thermophysical properties of polypropylene/aluminum composites
4. Berechnung verschiedener physikalischer Konstanten von heterogenen Substanzen. I. Dielektrizitätskonstanten und Leitfähigkeiten der Mischkörper aus isotropen Substanzen
5. Flexible and high thermal conductivity thin films based on polymer: Aminated multi-walled carbon nanotubes/micro-aluminum nitride hybrid composites
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