Recycle of printed circuit boards from waste electric and electronic equipment and their reusability as filler in 3D printed poly(lactic) acid composites-Reference-Cited by-同舟云学术

Recycle of printed circuit boards from waste electric and electronic equipment and their reusability as filler in 3D printed poly(lactic) acid composites

Published:2024-02-28 Issue:1 Volume:4 Page:
ISSN:2688-9277
Container-title:European Journal of Materials
language:en
Short-container-title:European Journal of Materials

Author:

Stratiotou Efstratiadis Vasileios¹²,Argyros Apostolos¹²,Efthymiopoulos Pavlos³,Maliaris Georgios⁴,Michailidis Nikolaos¹²

Affiliation:

1. Physical Metallurgy Laboratory, Mechanical Engineering Department, Aristotle University of Thessaloniki, Thessaloniki, Greece

2. Centre for Research & Development of Advanced Materials (CERDAM), Center for Interdisciplinary Research and Innovation, Balkan Centre, Thessaloniki, Greece

3. Additive Manufacturing Laboratory, Department of Chemistry, International Hellenic University, Kavala, Greece

4. Department of Chemistry, International Hellenic University, Kavala, Greece

Funder

Development of a Smart System for the Construction of Portable Houses Using the Prosthetic Construction Methodology

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/26889277.2024.2318374

Reference63 articles.

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2. On crystallization phenomena in PEEK☆

3. The effect of processing conditions and polymer crystallinity on the mechanical properties of unidirectional self-reinforced PLA composites

4. An Overview of Mechanical Properties and Material Modeling of Polylactide (PLA) for Medical Applications

5. Polymer viscosity, particle coalescence and mechanical performance in high-temperature laser sintering

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