A survey of dispatching rules for operational control in wafer fabrication

Author:

Sarin Subhash C.1,Varadarajan Amrusha1,Wang Lixin1

Affiliation:

1. a Grado Department of Industrial and Systems Engineering , Virginia Tech , Blacksburg, VA 24061, USA

Publisher

Informa UK Limited

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management,Computer Science Applications

Reference91 articles.

1. Cycle-time improvements for photolithography process in semiconductor manufacturing

2. Akcali , E . et al., 2000. Alternative loading and dispatching policies for furnace operations in semiconductor manufacturing: a comparison by simulation. J.A. Joines,et al. eds.Proceedings of the 2000 winter simulation conference, Orlando, Florida. Society for computer simulation international: San Diego, CA, USA, 1428–1435

3. A spatial rule adaptation procedure for reliable production control in a wafer fabrication system

4. Bahaji , N and Kuhl , ME . 2008. A simulation study of new multi-objective composite dispatching rules, CONWIP, and push lot release in semiconductor fabrication.International Journal of Production Research, 46 (14), 3801–3824

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