Interstitial carbon in copper: Electronic and mechanical properties-Reference-Cited by-同舟云学术

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Interstitial carbon in copper: Electronic and mechanical properties

Published:1999-10 Issue:10 Volume:79 Page:1615-1630
ISSN:1364-2812
Container-title:Philosophical Magazine B
language:en
Short-container-title:Philosophical Magazine B

Author:

Ellis D. E.¹,Mundim K. C.¹,Fuks D.²,Dorfman S.³,Berner A.⁴

Affiliation:

1. a Department of Physics and Astronomy and Materials Research Center , Northwestern University , Evanston , Illinois , 60208 , USA

2. b Department of Materials Engineering , Ben Gurion University of the Negev , POB 653 , Beer-Sheva , Israel

3. c Department of Physics , Technion , 32000 , Haifa , Israel

4. d Department of Materials Engineering , Technion , 32000 , Haifa , Israel

Publisher

Informa UK Limited

Subject

General Physics and Astronomy,General Chemical Engineering

Link

https://www.tandfonline.com/doi/pdf/10.1080/13642819908218326

Reference41 articles.

1. High-Performance dispersion-strengthened Cu-8 Cr-4 Nb alloy

2. Acoustic dispersion of (NH3C2H5)2MnCl4near the structural phase transition at 226 K

3. The spin-orbit interaction in metals and semiconductors

4. Electronic Structure of Transition Metals. I. Quantum Defects and Model Potential

5. Cast aluminum alloys containing dispersions of zircon particles

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2. First-principles investigation of site preference and diffusion behaviors of carbon in copper;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2015-06

3. Low temperature growth of carbon nanotubes on tetrahedral amorphous carbon using Fe–Cu catalyst;Carbon;2015-01

4. Towards understanding the carbon trapping mechanism in copper by investigating the carbon—vacancy interaction;Chinese Physics B;2013-07

5. The effect of deposition velocity and cluster size on thin film growth by Cu cluster deposition;Computational Materials Science;2012-12

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