Co-sputtering C-Cu thin film synthesis: Microstructural study of copper precipitates encapsulated into a carbon matrix-Reference-Cited by-同舟云学术

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Co-sputtering C-Cu thin film synthesis: Microstructural study of copper precipitates encapsulated into a carbon matrix

Published:1999-03 Issue:3 Volume:79 Page:501-516
ISSN:1364-2812
Container-title:Philosophical Magazine B
language:en
Short-container-title:Philosophical Magazine B

Author:

Cabioc'h Thierry¹,Naudon André¹,Jaouen Michel²,Thiaudiére Dominique³,Babonneau David¹

Affiliation:

1. a Université de Poitiers, Laboratoire de Métallurgie Physique , UMR 6630 CNRS, SP2MI, Bd3, Téléport 2, BP. 179, 86960 , Futuroscope Cedex , France

2. b Laboratoire pour Utilisation du Rayonnement Electromagnétique (LURE) , 91405 , Orsay , France

3. c ESRF, BP 220 , 38043 , Grenoble cedex , France

Publisher

Informa UK Limited

Subject

General Physics and Astronomy,General Chemical Engineering

Link

https://www.tandfonline.com/doi/pdf/10.1080/13642819908206423

Reference22 articles.

1. A new technique for fullerene onion formation

2. Carbon-based hard films produced by high-temperature carbon-ion implantation

3. Residual stresses and microstructure in tungsten thin films analyzed by x‐ray diffraction‐evolution under ion irradiation

4. Ion implanted, outdiffusion produced diamond thin films

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1. Kinetic modeling of phase separation and surface segregation in growing a-C:Ni thin films;Surface and Coatings Technology;2018-10

2. Tribological Properties of PVD Carbon-Copper Composite Films Reinforced by Titanium;Latvian Journal of Physics and Technical Sciences;2016-02-01

3. Tribological Properties of Sputter Deposited Carbon-Copper Composite Films;Proceedings of the 8th International Scientific Conference "BALTTRIB 2015";2015-11-26

4. Nanoindentation response analysis of Cu-rich carbon–copper composite films deposited by PVD technique;Surface and Coatings Technology;2015-10

5. Deformation behavior and interfacial sliding in carbon/copper nanocomposite films deposited by high power DC magnetron sputtering;Surface and Coatings Technology;2015-08

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