Numerical analysis of temperature field and thermal stress associated with dual-phase-lag heat conduction-Reference-Cited by-同舟云学术

Numerical analysis of temperature field and thermal stress associated with dual-phase-lag heat conduction

Published:2018-09-27 Issue:15 Volume:27 Page:1304-1311
ISSN:1537-6494
Container-title:Mechanics of Advanced Materials and Structures
language:en
Short-container-title:Mechanics of Advanced Materials and Structures

Author:

Li Jine¹,Wang Baolin²

Affiliation:

1. Architectural Engineering Institute, Jinling Institute of Technology, Nanjing, People’s Republic of China;

2. Centre for Infrastructure Engineering School of Computing Engineering and Mathematics, Western Sydney University, Penrith, New South Wales, Australia

Funder

National Science Foundation of China

Jinling Institute of Technology Research Innovation Foundation

Research Innovation Fund of Shenzhen City of China

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science,General Mathematics,Civil and Structural Engineering

Link

https://www.tandfonline.com/doi/pdf/10.1080/15376494.2018.1508793

Reference43 articles.

1. Second Sound in Solids

2. Heat waves

3. Addendum to the paper "Heat waves" [Rev. Mod. Phys. 61, 41 (1989)]

4. On the Wave Theory in Heat Conduction

5. Hyperbolic Heat Conduction Equation for Materials With a Nonhomogeneous Inner Structure

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