Analysis of a hollow piezoelectric semiconductor composite cylinder under a thermal loading-Reference-Cited by-同舟云学术

Analysis of a hollow piezoelectric semiconductor composite cylinder under a thermal loading

Published:2022-03-12 Issue: Volume: Page:1-10
ISSN:1537-6494
Container-title:Mechanics of Advanced Materials and Structures
language:en
Short-container-title:Mechanics of Advanced Materials and Structures

Author:

Yang Zhen¹,Zhang Zhicheng²,Liu Chengbin²^ORCID,Gao Cunfa³,Chen Weiqiu¹^ORCID,Zhang Chunli¹²^ORCID

Affiliation:

1. Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province & Department of Engineering Mechanics, Zhejiang University, Hangzhou, China

2. Department of Civil Engineering and Architecture, Zhejiang University, Hangzhou, China

3. Department of Engineering Mechanics, State Key Laboratory of Mechanics and Control of Mechanical Structures, Nanjing University of Aeronautics and Astronautics, Nanjing, China

Funder

the National Key Research and Development Project

National Natural Science Foundation of China

Natural Science Foundation of Zhejiang Provincial

State Key Laboratory of Mechanics and Control of Mechanical Structures

Nanjing University of Aeronautics and astronautics

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science,General Mathematics,Civil and Structural Engineering

Link

https://www.tandfonline.com/doi/pdf/10.1080/15376494.2022.2048424

Reference36 articles.

1. Piezopotential gated nanowire devices: Piezotronics and piezo-phototronics

2. Nanobelts, Nanowires, and Nanodiskettes of Semiconducting Oxides—From Materials to Nanodevices

3. ZnO nanostructures: growth, properties and applications

4. Recent advances in power generation through piezoelectric nanogenerators

5. P-Type Polymer-Hybridized High-Performance Piezoelectric Nanogenerators

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