Analysis of mechanical and thermal characterization of hexagonal boron nitride using a molecular dynamics simulation with the new Dreiding force field-Reference-Cited by-同舟云学术

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Analysis of mechanical and thermal characterization of hexagonal boron nitride using a molecular dynamics simulation with the new Dreiding force field

Published:2021-10-26 Issue: Volume: Page:1-9
ISSN:1537-6494
Container-title:Mechanics of Advanced Materials and Structures
language:en
Short-container-title:Mechanics of Advanced Materials and Structures

Author:

Oh Yuna¹²,Jung Hana¹,Bae Kwak Jin¹,Kim Yonjig²,Yu Jaesang¹

Affiliation:

1. Composite Materials Application Research Center, Institute of Advanced Composite Materials, Korea Institute of Science and Technology (KIST), Wanju-gun, Jeollabukdo, South Korea

2. Department of Mechanical Design Engineering, Jeonbuk National University, Jeonju, Jeollabukdo, South Korea

Funder

Ministry of Industry

the Ministry of Trade, Industry and Energy

the Ministry of Trade, Industry & Energy

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science,General Mathematics,Civil and Structural Engineering

Link

https://www.tandfonline.com/doi/pdf/10.1080/15376494.2021.1989639

Reference44 articles.

1. Large Scale Growth and Characterization of Atomic Hexagonal Boron Nitride Layers

2. Two dimensional hexagonal boron nitride (2D-hBN): synthesis, properties and applications

3. Hexagonal boron nitride is an indirect bandgap semiconductor

4. Thermal Conductivity and Phonon Transport in Suspended Few-Layer Hexagonal Boron Nitride

5. Stacking in Bulk and Bilayer Hexagonal Boron Nitride

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