Memory effects on the thermal fracture behavior of cracked plates via fractional heat conduction models-Reference-Cited by-同舟云学术

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Memory effects on the thermal fracture behavior of cracked plates via fractional heat conduction models

Published:2023-08-21 Issue: Volume: Page:1-10
ISSN:1537-6494
Container-title:Mechanics of Advanced Materials and Structures
language:en
Short-container-title:Mechanics of Advanced Materials and Structures

Author:

Xue Zhangna¹^ORCID,Zhang Hongtao¹,Liu Jianlin¹

Affiliation:

1. College of Pipeline and Civil Engineering, China University of Petroleum (East China), Qingdao, China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Shandong Province of China

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science,General Mathematics,Civil and Structural Engineering

Link

https://www.tandfonline.com/doi/pdf/10.1080/15376494.2023.2248140

Reference36 articles.

1. Integrated thermal protection system based on C/SiC composite corrugated core sandwich plane structure

2. Thermal Barrier Coatings for Gas-Turbine Engine Applications

3. Spherical Indentation on an Elastic Coating/Substrate System: Determining Substrate Modulus

4. Steady-state heat conduction problem of the interface crack between dissimilar anisotropic media

5. Thermal-induced interfacial cracking of magnetoelectroelastic materials

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1. Thermoelastic response analysis of a functionally graded rotating piezoelectric rod considering nonlocal effects and Kelvin–Voigt viscoelastic model;Mechanics of Advanced Materials and Structures;2023-10-26

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