Multi-Dimensional Matchmaking for Electronic Markets-Reference-Cited by-同舟云学术

Multi-Dimensional Matchmaking for Electronic Markets

Published:2002-10 Issue:9-10 Volume:16 Page:853-869
ISSN:0883-9514
Container-title:Applied Artificial Intelligence
language:en
Short-container-title:Applied Artificial Intelligence

Author:

Veit Daniel J.,Weinhardt Christof,Mu¨ller Jo¨rg P.

Publisher

Informa UK Limited

Subject

Artificial Intelligence

Link

http://www.tandfonline.com/doi/pdf/10.1080/08839510290030525

Reference24 articles.

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3. Distance measures for point sets and their computation

4. Eiter, T., Veit, D., Müller, J. and Schneider, M. Matchmaking for structured objects. Proceedings of the Third International Conference on Data Warehousing and Knowledge Discovery (DaWak). Munich, Germany. pp.186–194.

5. Technical Report Logic-92-1;Genesereth M. R.,1992

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