The effect of using wood chips exposed to mold fungi on the properties of chipboard-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

The effect of using wood chips exposed to mold fungi on the properties of chipboard

Published:2024-01-03 Issue:4 Volume:19 Page:920-930
ISSN:1748-0272
Container-title:Wood Material Science & Engineering
language:en
Short-container-title:Wood Material Science & Engineering

Author:

Mirski Radosław¹^ORCID,Kawalerczyk Jakub¹^ORCID,Dziurka Dorota¹^ORCID,Stuper-Szablewska Kinga²^ORCID,Walkiewicz Joanna¹^ORCID

Affiliation:

1. Department of Mechanical Wood Technology, Faculty of Forestry and Wood Technology, Poznań University of Life Sciences, Poznań, Poland

2. Department of Chemistry, Faculty of Forestry and Wood Technology, Poznań University of Life Sciences, Poznań, Poland

Funder

National Centre for Research and Development

NCBR

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/17480272.2023.2291534

Reference78 articles.

1. Development of a new rapid method for mould testing in a climate chamber: preliminary tests

2. From wood pellets to wood chips, risks of degradation and emissions from the storage of woody biomass – A short review

3. Potential use of decayed wood in production of wood plastic composite

4. Effects of anatomical and chemical properties of wood on the quality of particleboard

5. The Thickness Swelling of Wood Particleboard

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP