Mode I fracture of beech-adhesive bondline at three different temperatures-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Mode I fracture of beech-adhesive bondline at three different temperatures

Published:2022-11-07 Issue: Volume: Page:1-11
ISSN:1748-0272
Container-title:Wood Material Science & Engineering
language:en
Short-container-title:Wood Material Science & Engineering

Author:

Pečnik Jaka Gašper¹²^ORCID,Pondelak Andreja³^ORCID,Burnard Michael David¹²^ORCID,Sebera Václav⁴^ORCID

Affiliation:

1. InnoRenew CoE, Izola, Slovenia

2. Andrej Marušič Institute, University of Primorska, Koper, Slovenia

3. Slovenian National Building and Civil Engineering Institute, Ljubljana, Slovenia

4. Department of Wood Science and Technology, Faculty of Forestry and Wood Technology, Mendel University in Brno, Brno, Czech

Funder

European Commission for the InnoRenew project

Slovenian Research Agency

Czech Science Foundation

H2020 Spreading Excellence and Widening Participation

Publisher

Informa UK Limited

Subject

General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1080/17480272.2022.2135135

Reference45 articles.

1. Mixed-mode fracture toughness of bond lines of PRF and PUR adhesives in European beech wood

2. Specific fracture energy at glue joints in European beech wood

3. Static and dynamic tensile shear test of glued lap wooden joint with four different types of adhesives

4. CEN (2013) BS EN 302-1. Adhesives for Load-Bearing Timber Structures – Test Methods (Brussels, Belgium).

5. Thermal stability of glued wood joints measured by shear tests

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mode I fracture energy release rates of European beech wood-adhesive bonds;Wood Material Science & Engineering;2024-08-19

2. The Utilization of European Beech Wood (Fagus sylvatica L.) in Europe;Forests;2023-07-11

3. Mode I fracture properties of thermally-modified spruce wood ( Picea abies ) at different moisture contents;Wood Material Science & Engineering;2023-06-25

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3