Constructing efficient heat transfer channels at the interface of Diamond/Cu composites-Reference-Cited by-同舟云学术

Constructing efficient heat transfer channels at the interface of Diamond/Cu composites

Published:2020-07-16 Issue:6 Volume:28 Page:625-635
ISSN:0927-6440
Container-title:Composite Interfaces
language:en
Short-container-title:Composite Interfaces

Author:

Wu Xinzhi¹,Wan Dongqin¹,Zhang Wei¹,Song Manxin¹²,Peng Kun¹

Affiliation:

1. College of Materials Science and Engineering, Hunan University, Changsha, China

2. Hunan Engineering Technology Research Center for Microwave Devices and Equipment, Hunan Aerospace Chengyuan Precision Machinery Co., LTD, Changsha, China

Funder

Natural Science Foundation of Hunan Province

Publisher

Informa UK Limited

Subject

Surfaces, Coatings and Films,General Physics and Astronomy,Ceramics and Composites

Link

https://www.tandfonline.com/doi/pdf/10.1080/09276440.2020.1795466

Reference36 articles.

1. Managing heat for electronics

2. Thermal Boundary Conductance: A Materials Science Perspective

3. Thermal resistance reduction in high power superluminescent diodes by using active multi-mode interferometer

4. Diamond for neural interfacing: A review

5. Design of interfacial Cr3C2 carbide layer via optimization of sintering parameters used to fabricate copper/diamond composites for thermal management applications

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