Modeling and Simulation of Electronic Packages Subjected to Drop Impact

Author:

Sakri M. I.1,Saravanan S.1,Mohanram P. V.1

Affiliation:

1. a PSG College of Technology , Coimbatore , Tamilnadu , India

Publisher

Informa UK Limited

Subject

Computational Mathematics,Computational Mechanics

Reference19 articles.

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. PCB thermal reliability characteristics analysis under ambient temperature;Journal of Computational Methods in Sciences and Engineering;2020-09-30

2. Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads;Frattura ed Integrità Strutturale;2011-01-01

3. Adhesive features of bonded interfaces subjected to temperature shock;Journal of the Chinese Institute of Engineers;2010-09

4. Microfibrous metallic cloth for damping enhancement in printed circuit boards;Active and Passive Smart Structures and Integrated Systems 2010;2010-03-25

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