A Review of Thermal Transport in Low-Dimensional Materials Under External Perturbation: Effect of Strain, Substrate, and Clustering-Reference-Cited by-同舟云学术

A Review of Thermal Transport in Low-Dimensional Materials Under External Perturbation: Effect of Strain, Substrate, and Clustering

Published:2017-01-24 Issue:4 Volume:21 Page:201-236
ISSN:1556-7265
Container-title:Nanoscale and Microscale Thermophysical Engineering
language:en
Short-container-title:Nanoscale and Microscale Thermophysical Engineering

Author:

Shao Cheng¹,Yu Xiaoxiang²,Yang Nuo²,Yue Yanan³,Bao Hua¹

Affiliation:

1. University of Michigan–Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai, P.R. China

2. State Key Laboratory of Coal Combustion, Huazhong University of Science and Technology, Wuhan, P. R. China, and Nano Interface Center for Energy, School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan, P. R. China

3. School of Power and Mechanical Engineering, Wuhan University, Wuhan, P. R. China

Funder

National Natural Science Foundation of China

Publisher

Informa UK Limited

Subject

Mechanics of Materials,Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

Link

https://www.tandfonline.com/doi/pdf/10.1080/15567265.2017.1286421

Reference220 articles.

1. The electronic properties of graphene

2. Black phosphorus field-effect transistors