The Endoscopic Transnasal Approach to Orbital Tumors: A Review
Author:
Affiliation:
1. Ophthalmic Plastic Surgery Service, Department of Ophthalmology, Massachusetts Eye and Ear, Harvard Medical School, Boston, MA, USA
2. Department of Otolaryngology, Massachusetts Eye and Ear, Harvard Medical School, Boston, MA, USA
Funder
Edith R. Reshef
Publisher
Informa UK Limited
Subject
Ophthalmology,General Medicine
Link
https://www.tandfonline.com/doi/pdf/10.1080/08820538.2021.1890794
Reference70 articles.
1. “Round-the-Clock” Surgical Access to the Orbit
2. Endoscopic transnasal dacryocystorhinostomy
3. Endoscopic Transnasal Orbital Decompression
4. Endoscopic Approach to Traumatic Visual Loss
5. Endoscopic Management of Orbital Apex Lesions
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