Thermally Induced Piezothermoelastic Fields of a Smart Sandwich Cylindrical Structure with a Functionally Graded Interlayer-Reference-Cited by-同舟云学术

Thermally Induced Piezothermoelastic Fields of a Smart Sandwich Cylindrical Structure with a Functionally Graded Interlayer

Published:2014-03-28 Issue:5 Volume:37 Page:585-603
ISSN:0149-5739
Container-title:Journal of Thermal Stresses
language:en
Short-container-title:Journal of Thermal Stresses

Author:

Wang H. M.

Funder

The work was supported by the National Natural Science Foundation of China (Grant Nos. 11372273 and 11321202), the Key Team of Technological Innovation of Zhejiang Province (Grant No. 2011R09025-05), and the Zhejiang Provincial Natural Science Foundation of China (Grant No. LY13A020001).

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science

Link

http://www.tandfonline.com/doi/pdf/10.1080/10510974.2014.884894

Reference33 articles.

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5. Research on the displacement function and equivalent circuit of circular flexural vibration mode piezoelectric ceramic composite transducers

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