Dislocation sources and the flow stress of polycrystalline thin metal films-Reference-Cited by-同舟云学术

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Dislocation sources and the flow stress of polycrystalline thin metal films

Published:2003-01 Issue:1 Volume:83 Page:1-8
ISSN:0950-0839
Container-title:Philosophical Magazine Letters
language:en
Short-container-title:Philosophical Magazine Letters

Author:

von Blanckenhagen Burghard¹²,Gumbsch Peter¹²³,Arzt Eduard¹

Affiliation:

1. a Max-Planck-Institut für Metallforschung , Heisenbergstrasse 3 , Germany

2. b Institut für Zuverlässigkeit von Bauteilen und Systemen , Universität Karlsruhe , Kaiserstrasse 12, Karlsruhe , D-76131 , Germany

3. c Fraunhofer Institut für Werkstoffmechanik , Freibung und Halle, Wöhlerstrasse 11, Freiburg , D-79108 , Germany

Publisher

Informa UK Limited

Subject

Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/0950083021000050287

Reference31 articles.

1. Forest Dislocation Intersections in Stage I Deformation of Copper Single Crystals

2. The self-stress of dislocations and the shape of extended nodes

3. In situ transmission electron microscopy study of dislocations in a polycrystalline Cu thin film constrained by a substrate

4. In situ transmission electron microscopy study of thermal-stress-induced dislocations in a thin Cu film constrained by a Si substrate

5. Model validation of a 3D simulation of dislocation dynamics: Discretization and line tension effects

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