Thermal stability and mechanical properties of epoxy compounds cured with maleic anhydride using microwave field-Reference-Cited by-同舟云学术

Thermal stability and mechanical properties of epoxy compounds cured with maleic anhydride using microwave field

Published:2021-02-11 Issue:1 Volume:716 Page:61-68
ISSN:1542-1406
Container-title:Molecular Crystals and Liquid Crystals
language:en
Short-container-title:Molecular Crystals and Liquid Crystals

Author:

Bilogubka Oksana¹,Syrotynska Iryna²

Affiliation:

1. Research Department of Materials, Substances and Products, Ivano-Frankivsk Scientific Research Forensic Center of the Ministry of Internal Affairs of Ukraine, Ivano-Frankivsk, Ukraine

2. Biochemistry Department, Ivano-Frankivsk National Medical University, Ivano-Frankivsk, Ukraine

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/15421406.2020.1859696

Reference26 articles.

1. Application of epoxy resins in electronics and optoelectronics. Part I. Mechanical properties and thermal stability of epoxy resins used for encapsulation of electronic devices

2. Synthesis and application of epoxy resins: A review

3. Studies on the curing kinetics of epoxy resins using mixture of nadic/or maleic anhydride and 4,4′-diaminodiphenyl sulfone

4. Examining the influence of carboxylic anhydride structures on the reaction kinetics and processing characteristics of an epoxy resin for wind turbine applications

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