Material Properties and Reliability of Anisotropic Conductive Films (ACFs) Modified by POSS for Chip-on-Glass Assembly-Reference-Cited by-同舟云学术

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Material Properties and Reliability of Anisotropic Conductive Films (ACFs) Modified by POSS for Chip-on-Glass Assembly

Published:2011-10-18 Issue:1 Volume:550 Page:83-92
ISSN:1542-1406
Container-title:Molecular Crystals and Liquid Crystals
language:en
Short-container-title:Molecular Crystals and Liquid Crystals

Author:

Hwang Jin-Sang¹,Kim Ju-Yeol¹,Ku Dae-Young¹,Kwon Oh Hyeong²,Kwon Younghwan³

Affiliation:

1. a R&D Center, exax Inc. , 310 Gongdan-dong, Gumi-si , Gyeongbuk , Korea (ROK)

2. b Department of Polymer Science and Engineering , Kumoh National Institute of Technology, Gumi-si , Gyeongbuk , Korea (ROK)

3. c Department of Chemical Engineering , Daegu University , Gyeongbuk , Korea (ROK)

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/15421406.2011.600566

Reference12 articles.

1. Micropitch connection using anisotropic conductive materials for driver IC attachment to a liquid crystal display

2. Liu , J. Tolvgard , A. Malmodin , J. Lai , Z. and IEEE Trans Comp Packag Manuf Technol. 1999. 22(2): 186

3. Flip-chip on flex for 3D packaging

4. Toughening of trifunctional epoxy system. V. Structure-property relationships of neat resin

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