Experimental Investigation of Vapor Chamber Module Applied to High-Power Light-Emitting Diodes-Reference-Cited by-同舟云学术

Experimental Investigation of Vapor Chamber Module Applied to High-Power Light-Emitting Diodes

Published:2009-01-23 Issue:1 Volume:22 Page:26-38
ISSN:0891-6152
Container-title:Experimental Heat Transfer
language:en
Short-container-title:Experimental Heat Transfer

Author:

Huang H.-S.,Chiang Y.-C.,Huang C.-K.,Chen S.-L.

Publisher

Informa UK Limited

Subject

Electrical and Electronic Engineering,Instrumentation,Control and Systems Engineering

Link

http://www.tandfonline.com/doi/pdf/10.1080/08916150802530187

Reference16 articles.

1. Arik, M., Petroski, J. and Weaver, S. 2002. Thermal Challenges in the Future Generation Solid State Lighting Applications: Light Emitting Diodes. Proceedings of Intersociety Conference on Thermal Phenomena. May30–June 12002, San Diego, CA. pp.113–120.

2. Thermal management of LEDs: package to system

Cited by 26 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Performance Study of Plate-finned Vapor Chamber Heat Sink;J APPL COMPUT MECH;2024

2. Properties Related to the HLB Value of Hybrid Thermoelectric Nanofluids at Different Temperatures;Polymers;2024-02-13

3. Heat transfer performance analysis of an ultra-thin aluminum vapor chamber with serrated microgrooves;Applied Thermal Engineering;2023-07

4. Deployment of vapour chambers for electronic heat dissipation: state-of-the-art;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2022-05-19

5. Design, fabrication, and performance evaluation of a novel orientation independent and wickless heat spreader;International Journal of Heat and Mass Transfer;2020-06