Effect of water medium on material removal and sub-surface defect evolution in nano-cutting of single-crystal γ-TiAl alloy-Reference-Cited by-同舟云学术

Effect of water medium on material removal and sub-surface defect evolution in nano-cutting of single-crystal γ-TiAl alloy

Published:2021-09-14 Issue:17 Volume:47 Page:1433-1442
ISSN:0892-7022
Container-title:Molecular Simulation
language:en
Short-container-title:Molecular Simulation

Author:

Li Jianhua¹²,Wei Peng¹²,Liu Liqun³,Cao Hui¹²,Shao Zihao¹²,Li Haiyan¹²,Lei Chunli¹²,Feng Ruicheng¹²

Affiliation:

1. School of Mechanical and Electronical Engineering, Lanzhou University of Technology, Lanzhou, People’s Republic of China

2. Key Laboratory of Digital Manufacturing Technology and Application, Ministry of Education, Lanzhou University of Technology, Lanzhou, People’s Republic of China

3. Zhuzhou smelter Group Co., Ltd, Zhuzhou, People’s Republic of China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Gansu Province

The Hongliu First-class Disciplines Development Program of Lanzhou University of Technology

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science,General Chemical Engineering,Modelling and Simulation,Information Systems,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/08927022.2021.1977297

Reference36 articles.

1. Nondestructive measurement of machining-induced amorphous layers in single-crystal silicon by laser micro-Raman spectroscopy

2. Size effect in material removal by cutting at nano scale

3. Large-scale elastic-plastic indentation simulations via nonequilibrium molecular dynamics

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