On using the anisotropy in the thermal resistance of solid–fluid interfaces to more effectively cool nano-electronics-Reference-Cited by-同舟云学术

On using the anisotropy in the thermal resistance of solid–fluid interfaces to more effectively cool nano-electronics

Published:2019-11-06 Issue:2 Volume:46 Page:162-167
ISSN:0892-7022
Container-title:Molecular Simulation
language:en
Short-container-title:Molecular Simulation

Author:

Wang Xiaoyu¹^ORCID,Venerus David¹,Puri Ishwar K.²,Murad Sohail¹^ORCID

Affiliation:

1. Department of Chemical and Biological Engineering, Illinois Institute of Technology, Chicago, IL, USA

2. Department of Mechanical Engineering, Department of Engineering Physics, and Department of Materials Science and Engineering, McMaster University, Hamilton, Canada

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science,General Chemical Engineering,Modelling and Simulation,Information Systems,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/08927022.2019.1684488

Reference45 articles.

1. Emerging challenges and materials for thermal management of electronics

2. Novel nanostructured thermal interface materials: a review

3. Investigation into the microscopic mechanisms influencing convective heat transfer of water flow in graphene nanochannels

4. Transport Phenomena of Water in Molecular Fluidic Channels

5. Thermal transport across nanoscale solid-fluid interfaces

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