Topology optimization of damping layer in frequency-dependent viscoelastic sandwich panels considering steady-state free vibration-Reference-Cited by-同舟云学术

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Topology optimization of damping layer in frequency-dependent viscoelastic sandwich panels considering steady-state free vibration

Published:2024-02-19 Issue: Volume: Page:1-30
ISSN:1539-7734
Container-title:Mechanics Based Design of Structures and Machines
language:en
Short-container-title:Mechanics Based Design of Structures and Machines

Author:

Wang Jie¹²^ORCID,Cui Mingtao¹³⁴^ORCID,Li Wang¹³,Wang Xiaobo¹³

Affiliation:

1. Research Center for Applied Mechanics, School of Mechano-electronic Engineering, Xidian University, Xi’an, China

2. Shenzhen Dajiang Innovation Technology CO., LTD., Shenzhen, China

3. Shaanxi Key Laboratory of Space Extreme Detection, Xi’an, China

4. Department of Mechanical Engineering, McGill University, Montreal, Canada

Funder

Natural Science Foundation of Shaanxi Province

China Scholarship Council

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/15397734.2024.2315168

Reference44 articles.

1. Damping and Forced Vibration Analyses of Viscoelastic Shells

2. A Theoretical Basis for the Application of Fractional Calculus to Viscoelasticity

3. Analysis methods to support design for damping

4. Vibration control of plates with active constrained layer damping

5. Optimal shape design as a material distribution problem

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A dimensionality reduction optimization method for thin-walled parts to realize mass center control and lightweight design;Engineering Optimization;2024-08-14

2. Thermal Vibro-Acoustic Analysis Of Sandwich Panels with DYAD606 Frequency and Temperature Dependent Viscoelastic Core;Journal of Vibration Engineering & Technologies;2024-08-04

3. Topology optimization of orthotropic multi-material microstructures with maximum thermal conductivity based on element-free Galerkin method;Numerical Heat Transfer, Part A: Applications;2024-08

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