Incorporation of a nano/micro CuO formulation into phenol formaldehyde (PF) resin: Curing kinetics, morphological analysis, and application-Reference-Cited by-同舟云学术

Incorporation of a nano/micro CuO formulation into phenol formaldehyde (PF) resin: Curing kinetics, morphological analysis, and application

Published:2019-07-11 Issue:5 Volume:39 Page:372-383
ISSN:0277-3813
Container-title:Journal of Wood Chemistry and Technology
language:en
Short-container-title:Journal of Wood Chemistry and Technology

Author:

Guo Congnan¹²³,Yi Tengfei³⁴,Morrell Jeffrey J.⁴^ORCID,Gao Wei¹²³,Zhao Sisi¹²³,Zhan Ke¹²³,Yang Long³,Du Guanben¹²³

Affiliation:

1. Ministry of Education, Key Laboratory for Forest Resources Conservation and Utilization in the Southwest Mountains of China (Southwest Forestry University), Kunming, Yunnan Province, People’s Republic of China

2. Yunnan Key Laboratory of Wood Adhesives and Glue Products, Southwest Forestry University, Kunming, Yunnan Province, People’s Republic of China

3. College of Material Science and Engineering, Southwest Forestry University, Kunming, Yunnan Province, People’s Republic of China

4. National Centre for Timber Durability and Design Life, University of the Sunshine Coast, Sippy Downs, Qld, Australia

Funder

National Natural Science Foundation of China

the Project of Yunnan Reserve Talents of Young Academic and Technical Leaders

Publisher

Informa UK Limited

Subject

General Materials Science,General Chemical Engineering,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/02773813.2019.1636822

Reference25 articles.

1. Study on the pyrolysis of phenol-formaldehyde (PF) resin and modified PF resin

2. Boron-modified phenolic resins for high performance applications

3. Application of cure-accelerated phenol-formaldehyde (PF) adhesives for three-layer medium density fiberboard (MDF) manufacture

4. Zhang, J.; Zhang, W. U.S. Patent 7632567B1, Dec 15, 2009.

5. Brehmer, H. E.; Breyer, R. A.; Kennedy, H. J.; Knight, J. H. Yeager, D C. U.S. Patent 20110262760A1, Oct 27, 2011.

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