DEVELOPMENT AND EVALUATION OF A PLANAR HEAT PIPE FOR COOLING ELECTRONIC SYSTEMS
Author:
Affiliation:
1. a Department of Mechanical Engineering , University of Kansas , Lawrence , Kansas , 66045
Publisher
Informa UK Limited
Subject
General Chemical Engineering,General Chemistry
Link
https://www.tandfonline.com/doi/pdf/10.1080/00986449008940577
Reference15 articles.
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
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3. Simulation and Experimental Investigation of Thermal Performance of a Miniature Flat Plate Heat Pipe;Advances in Mechanical Engineering;2013-01
4. The Development of Polymer-Based Flat Heat Pipes;Journal of Microelectromechanical Systems;2011-04
5. Forming method of axial micro grooves inside copper heat pipe;Transactions of Nonferrous Metals Society of China;2008-10
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