1. Li, Y. (Ed.). Microelectronic Applications of Chemical Mechanical Planarization; Wiley-Interscience: Hoboken, NJ, 2008; 9 pp.
2. Murarka, S.P.; Verner, I.V.; Gutman, R.J. Copper—Fundamental Mechanisms for Microelectronic Applications; John Wiley & Sons, Inc.: New York, 2000; 337 pp.
3. Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective
4. Wagal, S.S. Diamond Coated Copper Optics. Patent No. WO 1996024488 A1, Aug. 15, 1996.