Comprehensive elemental screening of solid-solution copper alloys-Reference-Cited by-同舟云学术

Comprehensive elemental screening of solid-solution copper alloys

Published:2023-09-04 Issue:1 Volume:3 Page:
ISSN:2766-0400
Container-title:Science and Technology of Advanced Materials: Methods
language:en
Short-container-title:Science and Technology of Advanced Materials: Methods

Author:

Yamaguchi Kenji¹,Ishigaki Takuya¹,Inoue Yuki¹,Arisawa Shuhei²,Matsunoshita Hirotaka²,Ito Yuki²,Mori Hiroyuki²,Suehiro Ken’ichiro²,Maki Kazunari²,Nagata Kenji³,Demura Masahiko³

Affiliation:

1. Innovation Center, Mitsubishi Materials Corporation, Naka, Japan

2. Kitamoto-branch, Innovation Center, Mitsubishi Materials Corporation, Kitamoto, Japan

3. Research and Services Division of Materials Data and Integrated System, National Institute for Materials Science, Tsukuba, Japan

Funder

Mitsubishi Materials Corporation

Publisher

Informa UK Limited

Subject

General Medicine

Link

https://www.tandfonline.com/doi/pdf/10.1080/27660400.2023.2250704

Reference38 articles.

1. Davis JR, editor. ASM specialty handbook: copper and copper alloys. Materials Park (OH): ASM International; 2001.

2. Solid-solution copper alloys with high strength and high electrical conductivity

3. Effect of Plastic Deformation on the Proof Strength and Electrical Conductivity of Copper-Magnesium Supersaturated Solid-Solution Alloys

4. Material machine learning for alloys: Applications, challenges and perspectives

5. A property-oriented design strategy for high performance copper alloys via machine learning

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design of low-alloying and high-performance solid solution-strengthened copper alloys with element substitution for sustainable development;International Journal of Minerals, Metallurgy and Materials;2024-05