Credit risk-free sovereign bonds under Solvency II: a cointegration analysis with consistently estimated structural breaks
Author:
Publisher
Informa UK Limited
Subject
Economics and Econometrics,Finance
Link
http://www.tandfonline.com/doi/pdf/10.1080/09603107.2014.909573
Reference44 articles.
1. EMU and European government bond market integration
2. Heteroskedasticity and Autocorrelation Consistent Covariance Matrix Estimation
3. Testing for the Null Hypothesis of Cointegration with a Structural Break
4. Estimating and Testing Linear Models with Multiple Structural Changes
5. Interest rate linkages: a Kalman filter approach to detecting structural change
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