Neighbour-die effect on the measurement of wafer-level flip-chip LED dies in production lines-Reference-Cited by-同舟云学术

Neighbour-die effect on the measurement of wafer-level flip-chip LED dies in production lines

Published:2017-06-22 Issue:20 Volume:64 Page:2141-2148
ISSN:0950-0340
Container-title:Journal of Modern Optics
language:en
Short-container-title:Journal of Modern Optics

Author:

Chen Tengfei¹,Wan Zirui²,Li Bin¹²

Affiliation:

1. National Engineering Research Center of Manufacturing Equipment Digitization, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China

2. National Numerical Control System Engineering Research Center, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China

Funder

National Natural Science Foundation of China

Numerical Control Generation of Mechanical Product Innovation Application Demonstration Project in Guangdong Province Special Fund Project

Guangdong Province Special Fund

Publisher

Informa UK Limited

Subject

Atomic and Molecular Physics, and Optics

Link

https://www.tandfonline.com/doi/pdf/10.1080/09500340.2017.1343402

Reference18 articles.

1. Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

2. Study of light extraction efficiency of flip-chip GaN-based LEDs with different periodic arrays

3. Transient measurement of light-emitting diode characteristic parameters for production lines

4. Analysis on the effect of amorphous photonic crystals on light extraction efficiency enhancement for GaN-based thin-film-flip-chip light-emitting diodes

5. InGaN Flip-Chip Light-Emitting Diodes With Embedded Air Voids as Light-Scattering Layer

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