Research on ultra-smooth machining technique for monocrystalline silicon substrate-Reference-Cited by-同舟云学术

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Research on ultra-smooth machining technique for monocrystalline silicon substrate

Published:2020-08-15 Issue:14 Volume:67 Page:1227-1232
ISSN:0950-0340
Container-title:Journal of Modern Optics
language:en
Short-container-title:Journal of Modern Optics

Author:

Wang Zhe¹²,Wu Lingqi¹,Dun Aihuan¹,Fang Yuanyuan¹²,Song Li¹²,Zhu Xiaolei¹²

Affiliation:

1. Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai, People’s Republic of China

2. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, People’s Republic of China

Funder

National Key Research and Development Programme of China

Publisher

Informa UK Limited

Subject

Atomic and Molecular Physics, and Optics

Link

https://www.tandfonline.com/doi/pdf/10.1080/09500340.2020.1817589

Reference24 articles.

1. Overview of the SACLA facility

2. Hollow-core photonic crystal fibre for high power laser beam delivery

3. Shanghai Soft X-Ray Free-Electron Laser Facility

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Computational analysis of electronic structure and optical properties of monocrystalline silicon-vacancy defect system based on density functional theory;Materials Today Communications;2024-03

2. Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon;Materials;2022-08-17

3. Micro-channel fabrication on silicon wafer (100) using Rotary Ultrasonic Machining;Silicon;2022-02-24

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