The Use of Tin when Alloyed with Nickel or Lead as a Printed Circuit Finish
Author:
Publisher
Informa UK Limited
Subject
Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Link
https://www.tandfonline.com/doi/pdf/10.1080/00202967.1972.11870230
Reference10 articles.
1. In preparing this paper the following papers were consulted—
2. Electrodeposition of Tin-Nickel Alloy Plate from Chloride-Fluoride Electrolytes
3. A. E. Davies, Trans IMF, 1954, 31, Advance Copy No 24.
4. Stannous-fluoride complexes in a tin-nickel electrolyte
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