Electrodeposition of copper–tin alloys using deep eutectic solvents
Author:
Affiliation:
1. Materials Centre, Department of Chemistry, University of Leicester, Leicester LE1 7RH, UK
2. CSIRO Process Science and Engineering, Box 312, Clayton South, Victoria 3168, Australia
Funder
EU framework programme 6
Publisher
Informa UK Limited
Subject
Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Link
https://tandfonline.com/doi/pdf/10.1080/00202967.2016.1148442
Reference34 articles.
1. Electrodeposition of Sn–Cu alloy anodes for lithium batteries
2. Cu–Sn coatings obtained from pyrophosphate-based electrolytes
3. Recent trends in metal alloy electrolytic and electroless plating research: a review
4. A Comparative Study of Nickel Electrodeposition Using Deep Eutectic Solvents and Aqueous Solutions
5. Deep Eutectic Solvents (DESs) and Their Applications
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