Electrochemical double-pulse technique to modulate the roughened surface of copper foil for copper-clad laminates-Reference-Cited by-同舟云学术

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Electrochemical double-pulse technique to modulate the roughened surface of copper foil for copper-clad laminates

Published:2022-04-14 Issue:5 Volume:100 Page:276-282
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Wang Ni¹²,Chen Qi¹,Gong Xinyu¹,Hu Wencheng¹²^ORCID

Affiliation:

1. School of Materials and Energy, University of Electronic Science & Technology of China, Chengdu, People’s Republic of China

2. Yangtze Delta Region Institute, University of Electronic Science & Technology of China, Huzhou, People’s Republic of China

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/00202967.2022.2059847

Reference18 articles.

1. High-Performance Printed Circuit Board Materials Based on Benzoxazine and Epoxy Blend System

2. Printed circuit board industry

3. Composition-dependent curing behavior and peel strength of epoxy resins for printed circuit boards (PCBs)

4. Materials and micro drilling of high frequency and high speed printed circuit board: a review

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives;Materials Science and Engineering: B;2024-01

2. Fabrication of High-Performance Insulated Metal Substrates Employing h-BN Mixture/Epoxy Composite Coated on Roughened Copper Plate;Materials Science;2023-11-08

3. Multi-scan cyclic voltammetry to roughen the surface of copper foil for application in copper-clad laminates;Transactions of the IMF;2023-07-31

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