Formation of embedded fine copper patterns in various resins by the transfer of plated metal patterns-Reference-Cited by-同舟云学术

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Formation of embedded fine copper patterns in various resins by the transfer of plated metal patterns

Published:2017-03-02 Issue:2 Volume:95 Page:78-82
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Horiuchi Y.¹²,Miyazeki Y.²³,Noh J.-H.²³,Honma H.²,Takai O.¹²,Cordonier C. E. J.²

Affiliation:

1. Department of Industrial Chemistry, Graduate School of Engineering, Kanto Gakuin University, Yokohama 236-8501, Japan

2. Materials & Surface Engineering Research Institute, Kanto Gakuin University, Yokohama 236-0004, Japan

3. Department of Physics, Electrical and Computer Engineering, Graduate School of Engineering, Yokohama National University, Yokohama 240-8501, Japan

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/00202967.2017.1256104

Reference22 articles.

1. Chromium Free Alternative Etching Treatment for Plating on ABS Resin Using TiO2 as Photocatalyst

2. Pretreatment of Nickel Plating on ASA Resin Using Ozonated Water as Replacement for Chromic Acid Etching

3. Surface Reforming of ABS Resin Using TiO2 under UV Light Irradiation

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